Perhaps you have noticed, but I have — the 50 year old DIP IC package is gradually becoming obsolete and most new IC devices do not have a DIP counterpart. I’m not necessarily talking about the ...
Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...
The transfer molded DIP-IPM was first introduced in 1998 to address the rapidly growing demand for cost-effective motor control in consumer appliance applications. These devices soon became widely ...
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