EDN

DRAM basics and its quest for thermal stability by optimizing peripheral transistors

For decades, compute architectures have relied on dynamic random-access memory (DRAM) as their main memory, providing temporary storage from which processing units retrieve data and program code. The ...
Semiconductor Engineering

Improving DRAM Performance Using Dual Work-Function Metal Gate (DWMG) Structures

Dynamic Random Access Memory (DRAM) serves as the backbone of modern computing, enabling devices ranging from smartphones to high-performance servers. As the demand accelerates for higher density and ...
Semiconductor Engineering

DRAM Test And Inspection Just Gets Tougher

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...
NextBigFuture

NEO Semiconductor 3D X-DRAM With 8x the Density Of DDR5 Computer Memory

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
TweakTown

SK hynix developing 3D DRAM it calls 4F2 DRAM: joins South Korean competitor Samsung's 3D DRAM

SK hynix has just announced it's planning to develop a 4F2 (square) DRAM, joining South Korean rival Samsung and its journey into the world of 3D DRAM. The cost of EUV (extreme lithography) processes ...