Abstract “Packaging process is an indispensable part in the process of electronic components manufacturing, and its packaging quality directly affects the nominal power, reliability and other ...

The future of digital computing and communications will involve both electronics—manipulating data with electricity—and ...

Huawei chip stack packaging patent Just like the first patent, the State Intellectual Property Office also announced a Huawei patent on “chip stack packaging structure, packaging method and ...

Are there any case studies referencing the use of Master Bond products in wearable electronic devices? Yes, in fact, Master Bond EP37-3FLF 1 epoxy adhesive was singled out for its outstanding ability ...

This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated ...

The IEEE Electronics Packaging Award and the society’s other annual awards were presented on 31 May in San Diego, California, at the 2018 IEEE Electronic Components and Technology Conference ...

Electronic Design's Lee Goldberg chronicles a year of remarkable advances in power, power-conversion and power-management ICs, and packaging technology with a baker’s dozen of 2024's most ...