Fudzilla

Powertech bets on AI to boost chip testing business

DRAM and logic packaging orders on the rise, says CEO Powertech Technology (PTI) chief Xie Yongda says the company is looking ...
Morningstar

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor ...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing.
Digi Times

ASE and PTI step up FOPLP investments to tap AI boom

ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI) and ...
DIGITIMES

Powertech secures full FOPLP bookings ahead of US$1B expansion

Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out ...
AZOM

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99 % for Underfilling During ...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing.