EDN

KLA-Tencor says backside wafer inspection finds lurking defects

SAN JOSE –KLA-Tencor Corp. today said it is the first company to supply a fully automated system for inspection of wafer backsides during the production of 0.13-micron ICs on 300-mm silicon substrates ...
EDN

KLA-Tencor Develops Backside Inspection Tool

KLA-Tencor Corp. hopes to open a new market for wafer backside inspection with the introduction of an automated wafer backside inspection module today for its Surfscan 300mm-defect inspection tool.
Semiconductor Engineering

Marginal Wafer Defects Can Slip Past Electrical Testing

Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know that, unfortunately, even 100% end-of-line electrical testing of semiconductor wafers will not ...
Business Wire

Onto Announces New EB40 All-Surface Inspection Module for Wafer Fabs and Advanced Packaging

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of the Company’s Dragonfly ® G3 system with the ...
Finanznachrichten

Wafer Defect Inspection System Market to Reach USD 14.43 Billion by 2031 on Rising Advanced Chip Manufacturing | Valuates Reports

What is the Market Size of Wafer Defect Inspection System? BANGALORE, India, Dec. 16, 2025 /PRNewswire/ -- In 2024, the global market size of Wafer Defect Inspection System was estimated to be worth ...
Semiconductor Engineering

Fabs Drive Deeper Into Machine Learning

Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and ...