This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66% with Nordson Electronics Solutions ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Discover how the optional patented turret ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Discover how the optional patented turret ...

Press Release April 29, 2025 - Click the title to read the full press release. Toughened, UV Curable Adhesive Features Optical Clarity Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, ...

CEA-Leti and Soitec announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully depleted silicon-on-insulator ... Semiconductor ...

Deca Technologies announced the signing of an agreement with IBM to implement Deca's M-Series™ and Adaptive Patterning® technologies in IBM's advanced packaging ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Balazs™ provides analytical services to high-tech ...

Agileo Automation announced the future expansion of its A²ECF-SEMI automation framework to include SEMI's EDA (Equipment Data Acquisition) standards suite. This ... Agileo Automation ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. If you have any questions on your Thermal Warpage and ...

Semiconductor Packaging News - Exclusive: Univ. of Michigan Research Study Demonstrates Novel Synthesis Using Veeco's Fiji ALD System ...