Tin-plated copper structure was widely applied in the electronic products. With the development of the electronics industry, the integration degree increased and the component size reduced obviously.

Real-time monitoring of additive concentrations in acidic copper plating solution is a critical technology for ensuring process stability and reliability in copper interconnect fabrication for ...

This paper studied the process of filling Through glass via (TGV) in glass substrates with electrolytic copper plating. This process uses a 2 -step plating method. In the first step, Periodic pulse ...

Copper-deficient copper sulfide (Cu2–xS) nanoparticles (NPs) have been investigated as important hole-based plasmonic materials because of their size, morphology, and carrier density-dependent ...

Copper prices surge, consumption takes another hit; market activity remains sluggish [SMM North China Spot Copper] Shanghai’s spot copper premiums/discounts (fourth session) on July 2 [SMM Price] ...

If the US tariff policy is implemented or the US Fed's interest rate cut exceeds expectations, copper prices may continue to rise. In the medium and long term, attention still needs to be paid to the ...