Imec and TNO have officially launched the Holst Centre Photonics Lab, a state-of-the-art facility dedicated to integrated ...

GaN (Gallium Nitride) technology innovator Finwave Semiconductor has announced a successful $8.2m bridge investment round.

Rambus has made available complete client chipsets for next-generation AI PC memory modules with two new PMICs.

Hirose has developed an automotive wire-to-board connector that meets the GMW3191 standard for automotive applications.

OMRON Electronic Components Europe has introduced the G9EJH-1-E, an ultra-compact DC power relay, delivering inrush ...

Despite several profitable quarters Microsoft has announced that it plans to lay off nearly 3% of its entire workforce.

Critically, fostering collaboration between analogue and digital teams creates the cultural change necessary for success. The ...

Questa One smart verification software portfolio combines connectivity, a data driven approach and scalability with AI.

Following on from the Sycamore µSpeaker, launched in late 2024, the Sycamore-W extends xMEMS’ commitment to µFidelity audio ...

ST inertial measurement unit combines sensors for activity tracking and high-g impact measurement in a single package.

Samsung, much like Intel, has been looking to close the gap with TSMC by landing major external orders for its 2nm node.

CELUS, the AI-assisted electronics design platform developer, has announced its next generation of AI driven hardware.