Part of Kioxia's LC9 series of enterprise SSDs, the new drive offers 245.76TB of capacity by stacking 32 2Tb QLC 3D flash ...

Kioxia is sampling new UFS Ver. 4.1 embedded memory devices using CBA (CMOS directly Bonded to Array) technology which directly bonds the CMOS circuitry to the memory array, enabling gains in power ...

By directly bonding the CMOS circuitry to the memory array, CBA technology enables major gains in power efficiency, performance and density. With a blend of speed and low power use, Kioxia’s UFS Ver.

This letter proposes a bidirectional long short-term memory (BiLSTM) network to predict the excitations of antenna arrays for arbitrary radiation patterns. Compared to artificial neural networks (ANN) ...

An in-array Build-In Self-Test (BIST) scheme is proposed for the embedded SRAM array. The linear feedback shift register (LFSR) is used to implement the pattern generator, and the ...

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-6, the latest Low Power Double ...

TOKYO-- (BUSINESS WIRE)--Jul 8, 2025--UFS Ver. 4.1 devices from Kioxia integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package. These new UFS ...

Initially developed solely for data retention, these technologies are evolving to support new paradigms, such as in-memory computing, where processing occurs directly within the memory array.

HUNTINGTON — Memory bricks from the demolition of Holderby Hall on Marshall University’s Huntington campus will be available to members of the public beginning Monday, June 30.