Long-term hermetic vacuum wafer-level packaging (WLP) by bonding with copper-tin (CuSn) thin films is presented. By improving the pretreatment of bonding, the shear strength reached 74 MPa on average ...

Product security and reliability are major concerns in the semiconductor and PCB fabrication industries. Because of this, ...

We have developed a numerical analysis model to simulate the thermal runaway in copper-plated multifilament coated conductors. We combined a circuit model to calculate current distribution in ...